Category · 7 products

Mobile & Embedded

Managed NAND and multichip solutions: UFS 4.0 and 3.1 for flagship and mid-range mobile, eMMC 5.1 for cost-optimized and automotive designs, and uMCP/eMCP packages combining LPDDR and managed NAND in one footprint.

SK hynix ZUFS 4.0, UFS BGA — MANAGED NAND · PACKAGE VIEW · Image: skhynix.com

UFS

3 products

Universal Flash Storage for smartphones, automotive, and embedded compute.

SK hynixMass Production

SK hynix ZUFS 4.0

UFS 4.0UFS BGA

256 GB · 512 GB · 1 TB

UFS 4.0 with zoned storage management, holding sequential reads above 4,000 MB/s while reducing long-term fragmentation.

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SamsungMass Production

Samsung UFS 4.0

UFS 4.0UFS BGA

256 GB · 512 GB · 1 TB

UFS 4.0 managed NAND with up to 4,200 MB/s reads and double the power efficiency of UFS 3.1, in capacities to 1 TB.

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SamsungMass Production

Samsung UFS 3.1

UFS 3.1UFS BGA

128 GB · 256 GB · 512 GB

UFS 3.1 managed NAND at up to 2,100 MB/s reads, the volume storage tier for mid-range phones and automotive IVI.

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eMMC

2 products

e.MMC 5.1 managed NAND for cost-sensitive and long-lifecycle designs.

SamsungMass Production

Samsung eMMC 5.1

e.MMC 5.1153-ball FBGA

8 GB · 16 GB · 32 GB · 64 GB · more

e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.

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SK hynixMass Production

SK hynix eMMC 5.1

e.MMC 5.1153-ball FBGA

16 GB · 32 GB · 64 GB · 128 GB · more

e.MMC 5.1 managed NAND from SK hynix with wide-temperature options for industrial, automotive, and IoT programs.

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MCP

2 products

Multichip packages combining LPDDR DRAM with UFS or eMMC storage.

SK hynixMass Production

SK hynix uMCP (LPDDR5X + UFS)

LPDDR5X + UFS 3.1uMCP BGA

8+128 GB · 12+256 GB · 16+512 GB

UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.

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SamsungMass Production

Samsung eMCP (LPDDR4X + eMMC)

LPDDR4X + e.MMC 5.1eMCP BGA

3+32 GB · 4+64 GB · 8+128 GB

eMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.

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At a glance

Compare mobile & embedded

Every product in this category on one table. Open a row for the full specification.

Product	Manufacturer	Interface	Form factor	Capacities	Status
SK hynix ZUFS 4.0	SK hynix	UFS 4.0	UFS BGA	256 GB, 512 GB, 1 TB	Mass Production
Samsung UFS 4.0	Samsung	UFS 4.0	UFS BGA	256 GB, 512 GB, 1 TB	Mass Production
Samsung UFS 3.1	Samsung	UFS 3.1	UFS BGA	128 GB, 256 GB, 512 GB	Mass Production
Samsung eMMC 5.1	Samsung	e.MMC 5.1	153-ball FBGA	8 GB, 16 GB, 32 GB, 64 GB, 128 GB, 256 GB	Mass Production
SK hynix eMMC 5.1	SK hynix	e.MMC 5.1	153-ball FBGA	16 GB, 32 GB, 64 GB, 128 GB, 256 GB	Mass Production
SK hynix uMCP (LPDDR5X + UFS)	SK hynix	LPDDR5X + UFS 3.1	uMCP BGA	8+128 GB, 12+256 GB, 16+512 GB	Mass Production
Samsung eMCP (LPDDR4X + eMMC)	Samsung	LPDDR4X + e.MMC 5.1	eMCP BGA	3+32 GB, 4+64 GB, 8+128 GB	Mass Production

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