MCP · SK hynix
SK hynix uMCP (LPDDR5X + UFS)
LPDDR5X DRAM and UFS storage combined in a single mobile package
SK hynixMass ProductionMCP
- Interface
- LPDDR5X + UFS 3.1
- Form factor
- uMCP BGA
- Capacities
- 8+128 GB12+256 GB16+512 GB
Overview
UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
The uMCP stacks LPDDR5X DRAM and UFS managed NAND in one package, cutting board footprint and simplifying routing for mid-range and slim smartphone designs. Combinations pair 8 to 16 GB of LPDDR5X with 128 to 512 GB of UFS 3.1 storage.
Single-package sourcing also consolidates procurement and qualification: one part number covers the memory subsystem. SK hynix supplies uMCP across consumer temperature grades with power characteristics tuned for battery-first duty cycles.
Specifications
Specifications
| Interface | LPDDR5X + UFS 3.1 |
|---|---|
| Form Factor | uMCP BGA |
| DRAM | 8 GB / 12 GB / 16 GB LPDDR5X |
| Storage | 128 GB / 256 GB / 512 GB UFS |
| DRAM Data Rate | Up to 8533 Mbps/pin |
| Storage Read | Up to 2,100 MB/s |
| Operating Temp | -25°C to 85°C |
Application areas
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