Resources
Planning inputs, published
We publish the same analysis our program managers use internally — because a customer who understands the market makes better program decisions, and because we believe supply intelligence should read like engineering documentation, not marketing.
Memory Market Outlook — quarterly
Each quarter, our analysts publish a structured outlook covering DRAM and NAND supply-demand balance, pricing trajectory by density and grade, fab and process-node developments, and the implications for buffer sizing and purchase timing. The Outlook is written for planners: every claim is tied to an observable indicator, and every forecast carries its confidence level. Recent editions have covered DDR4-to-DDR5 transition economics for industrial users, the divergence between consumer and industrial NAND pricing, and how fab investment cycles translate into lead-time behavior twelve months out.
EOL Bulletins — as events require
When a discontinuation, die-revision consolidation, or significant product-change notification affects part families under our surveillance, we publish an EOL Bulletin: what changed, which part families are affected, the practical decision window, and the options — last-time buy, migration, or monitored continuation. Program customers receive part-number-specific alerts first; the public bulletin covers the family-level picture. Bulletins are archived and searchable, forming a running history of lifecycle events in the memory market.
Engineering Notes — storage selection in practice
Our Engineering Notes series addresses the questions design teams actually ask us:
Choosing between eMMC and UFS
for a ten-year industrial platform — interface longevity versus performance headroom
SLC, MLC, TLC, and pseudo-SLC
endurance arithmetic for logging-heavy embedded workloads
Industrial SSD selection
what "industrial grade" does and does not guarantee, and which datasheet parameters predict field behavior
Firmware revision control
why your qualification should lock controller firmware, and how to specify that contractually
Designing for the last-time buy
BOM decisions at design stage that halve your obsolescence exposure later
Each note is written by our technical staff, reviewed for accuracy, and dated — so you always know which market moment it describes.
Glossary — the shared vocabulary of memory supply
Continuity planning fails fastest when engineering, procurement, and finance use the same words to mean different things. Our glossary defines the working vocabulary of memory supply — from floor life and moisture sensitivity level to last-time-buy window, die revision, buffer coverage, and planning horizon — in plain, precise language suitable for internal documents. Teams tell us they link it in their own process documentation; that is exactly what it is for.
Sample entries
- Floor life
- The time a moisture-sensitive device may remain outside its sealed barrier bag before bake or reflow constraints apply.
- MSL (moisture sensitivity level)
- The classification defining a packaged device's floor life and required handling controls.
- LTB window
- The decision period between an end-of-life notice and the vendor's final order date.
- Buffer coverage
- Held safety stock expressed in weeks of demand at the current consumption rate.
Access
Market Outlooks and Engineering Notes are available on registration. EOL Bulletins and the Glossary are open. Program customers receive everything directly, plus part-number-level alerting through their program manager.
- Memory Market OutlookRegistration
- Engineering NotesRegistration
- EOL BulletinsOpen
- GlossaryOpen
- Part-number-level alertingProgram customers
Quarterly