Category · 5 products
High Bandwidth Memory
TSV-stacked high bandwidth memory from SK hynix and Samsung, from HBM2E through 12-high HBM3E, supplying the per-package bandwidth required by AI training and HPC silicon.
HBM3E
3 products
Fifth-generation extended HBM at 9+ Gbps per pin, up to 36 GB per stack.
HBM3
1 product
6.4 Gbps HBM in volume production for shipping accelerator platforms.
HBM2E
1 product
Proven HBM generation for HPC, networking, and FPGA designs.
At a glance
Compare high bandwidth memory
Every product in this category on one table. Open a row for the full specification.
| Product | Manufacturer | Interface | Form factor | Capacities | Status |
|---|---|---|---|---|---|
| SK hynix HBM3E 12-Hi 36GB | SK hynix | HBM3E | HBM stack (2.5D) | 36 GB | Mass Production |
| SK hynix HBM3E 8-Hi 24GB | SK hynix | HBM3E | HBM stack (2.5D) | 24 GB | Mass Production |
| Samsung HBM3E Shinebolt | Samsung | HBM3E | HBM stack (2.5D) | 24 GB, 36 GB | Mass Production |
| SK hynix HBM3 24GB | SK hynix | HBM3 | HBM stack (2.5D) | 16 GB, 24 GB | Mass Production |
| Samsung HBM2E Flashbolt | Samsung | HBM2E | HBM stack (2.5D) | 16 GB | Mass Production |