Samsung eMMC 5.1, 153-ball FBGA e.MMC 5.1
MANAGED NAND · PACKAGE VIEW · Image: samsung.com

eMMC · Samsung

Samsung eMMC 5.1

Cost-optimized managed NAND for entry mobile, IoT, and automotive designs

SamsungMass ProductionLong Lifecycle
Interface
e.MMC 5.1
Form factor
153-ball FBGA
Capacities
8 GB16 GB32 GB64 GB128 GB256 GB

Overview

e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.

eMMC 5.1 is the workhorse managed-NAND interface for entry smartphones, tablets, set-top boxes, smart TVs, and countless embedded designs. Samsung's parts run HS400 mode at up to 250 MB/s sequential read with capacities from 8 GB to 256 GB.

The integrated controller handles wear leveling, bad-block management, and ECC, letting host SoCs use simple MMC interfaces without NAND management burden. Automotive and industrial temperature grades extend the line into telematics, cluster, and factory applications.

Specifications

Specifications

Specifications for Samsung eMMC 5.1
Interfacee.MMC 5.1, HS400
Form Factor153-ball FBGA (11.5 x 13 mm)
Capacities8 GB to 256 GB
Sequential ReadUp to 250 MB/s
Sequential WriteUp to 125 MB/s
NAND TypeSamsung V-NAND TLC / MLC options
FeaturesCommand queue, RPMB, secure erase
Temp GradesConsumer, industrial, automotive

Discuss Samsung eMMC 5.1 availability with a program manager.