HBM3 · SK hynix
SK hynix HBM3 24GB
6.4 Gbps HBM3 in proven volume production on shipping accelerator platforms
SK hynixMass Production
- Interface
- HBM3
- Form factor
- HBM stack (2.5D)
- Capacities
- 16 GB24 GB
Overview
HBM3 stacks at 6.4 Gbps per pin and up to 24 GB, the memory of record for the first wave of large AI training GPUs.
HBM3 powered the first generation of large-scale AI training deployments, and SK hynix's 24 GB 12-high stack remains in volume production for shipping accelerator platforms. At 6.4 Gbps per pin the stack delivers about 819 GB/s of bandwidth.
For programs that qualified on HBM3 and continue to build, the part offers mature yield, stable pricing relative to HBM3E, and an established thermal envelope. 8-high 16 GB variants serve HPC and networking silicon with smaller capacity requirements.
Specifications
Specifications
| Interface | HBM3, 1024-bit |
|---|---|
| Stack Height | 8-high / 12-high |
| Capacity | 16 GB / 24 GB per stack |
| Data Rate | 6.4 Gbps/pin |
| Bandwidth | 819 GB/s per stack |
| Packaging | MR-MUF, TSV |
| Target | AI accelerators, HPC, networking |
Application areas
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