DRAM COMPONENT · BGA PACKAGE · Reference drawing, not to scale

DDR5 · SK hynix

SK hynix DDR5 24Gb Component

Non-binary 24 Gb DDR5 die enabling 48 GB and 96 GB module capacities

SK hynixMass ProductionNon-binary
Interface
DDR5
Form factor
FBGA component
Capacities
24 Gb

Overview

24 Gb DDR5 component on SK hynix's 1b-nm node, the die behind 48 GB and 96 GB non-binary module capacities.

SK hynix's 24 Gb DDR5 die introduced non-binary density scaling to volume DRAM production. Built on the 1b-nm node, it enables 48 GB and 96 GB modules from monolithic die, giving system designers a capacity step between binary tiers without TSV stacking cost.

The component ships in x8 organization at speed bins to 6400 MT/s and supports the full DDR5 feature set including on-die ECC. It is the basis of SK hynix's 96 GB RDIMM line and is available to OEMs building high-density custom modules.

Specifications

Specifications

Specifications for SK hynix DDR5 24Gb Component
InterfaceDDR5
Density24 Gb
Organizationx8
Data RateUp to 6400 MT/s
Voltage1.1 V
Process1b-nm
PackageFBGA
FeaturesOn-die ECC

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