SK hynix DDR5 16Gb Component, FBGA component DDR5
DRAM COMPONENT · BGA PACKAGE · Image: skhynix.com

DDR5 · SK hynix

SK hynix DDR5 16Gb Component

16 Gb DDR5 component for module and embedded board designs

SK hynixMass Production
Interface
DDR5
Form factor
FBGA component
Capacities
16 Gb

Overview

16 Gb DDR5 DRAM component in x8/x16 organizations for OEM module manufacturing and embedded designs up to 6400 MT/s.

The 16 Gb DDR5 component is the building block of mainstream DDR5 modules and down-soldered embedded designs. SK hynix supplies the die in x8 and x16 organizations across standard speed bins to 6400 MT/s, with on-die ECC and decision-feedback equalization improving signal integrity at high data rates.

For embedded and networking OEMs, component-level sourcing enables memory-down layouts on routers, switches, and controller boards where DIMM sockets are impractical. Standard FBGA packaging and JEDEC-compliant timings simplify qualification across multiple board programs.

Specifications

Specifications

Specifications for SK hynix DDR5 16Gb Component
InterfaceDDR5
Density16 Gb
Organizationx8, x16
Data Rate4800–6400 MT/s
Voltage1.1 V
PackageFBGA
FeaturesOn-die ECC, DFE
Operating Temp0°C to 95°C

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